CVE-2019-17517

The CVE-2019-17517 entry concerns Dialog Semiconductor BLE: the L2CAP payload length is not properly restricted in the BLE stack implemented in the DA14580/DA14583 devices (SDK up to 5.0.4). Root cause: insufficient validation during Link Layer processing of L2CAP packets. Impact: potential buffe...

CVE-2019-17518

Vulnerability: CVE-2019-17518 affects Dialog Semiconductor BLE SDK (DA1468x) up to version 1.0.14.1081. Root cause: Bluetooth Low Energy link-layer processing accepts a payload length larger than expected, triggering a buffer overflow. Impact: attackers in radio range can exploit crafted packets ...